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In the past Wi-Fi technology, intercell co-channel interference (Co-Channel Interference,CCI) is another important factor affecting channel capacity. The core of CSMA/CA is to listen before you speak (listen before talk,LBT). The device monitors the wireless channel first and sends data without being occupied. In the case of multi-AP mesh networking (AP,Access Point, wireless access point), the equipment in the cell will listen to the interference signal of the cell adjacent to the same channel, causing the device to mistakenly think that the wireless channel of the cell is being occupied at this time, so stop transmitting. This kind of interference will significantly reduce the network capacity when the network is not optimized or the number of available channels is very small. As shown in the figure below, the four Wi-Fi AP are networked with three channels. However, since there are only three channels available, AP1 and AP2 have to be deployed on the same channel Channel 6, when the signal of AP2 is interference to the user equipment belonging to AP1-Overlapped Basic Service Set (OBSS, overlapping basic service units, which can be understood as overlapping cells with the same frequency).
From April 2020 to June 2020, the demand for cars dropped sharply due to the spread of the COVID-19 epidemic. Automakers purchase parts according to Toyota’s “Just In Time” mode of operation, so, for example, Toyota canceled orders for in-car semiconductors for Denso, its main subcontractor, which canceled orders for in-car semiconductors such as Renesas, which then cancelled subsequent orders for 28nm, which was commissioned by TSMC. Due to the special needs of COVID-19 at home under the epidemic, the production of 28nm semiconductors such as TSMC game consoles and household appliances swarmed in, and the blank production line after the cancellation of car semiconductors was instantly filled with these semiconductors.
Key Technologies of SoC Design: SoC key technologies mainly include bus architecture technology, IP core reuse technology, software and hardware co-design technology, SoC verification technology, testability design technology, low-power design technology, ultra-deep sub-micron circuit implementation technology, and embedded software porting. A circuit system capable of realizing certain functions is composed of multiple modules, such as processors, interfaces, memories, analog-to-digital converters, and so on. These functional modules can be implemented by discrete devices, and then combined on a printed circuit board (PCB) to finally form a system-on-a-Board. A schematic diagram of the on-board system is shown below.
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